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  • 3D-OEDL

3 Papers in VLSI 2022

Congratulations to Dae-myeong, Jinha, Jae Yong, and Juhyuk for their work.


  • J. Park+, D. -M. Geum+, W. Baek, J. Shieh, S. -H. Kim*, "Monolithic 3D sequential integration realizing 1600-PPI red micro-LED display on Si CMOS driver IC", Symposium on VLSI Technology and Circuits, 2022/6, Hawai, US

  • J. Jeong, S. -K. Kim, J. Kim, D. -M. Geum, J. Lee, S. -Y. Park, S. -H. Kim*, "3D Stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing systems", Symposium on VLSI Technology and Circuits, 2022/6, Hawai, US

  • D. -M. Geum+, J. Lim+, J. Jang, S. Ahn, S. -K. Kim, J. Shim, B. -H. Kim, J. Park, W. -J. Baek, J. Jeong, S. -H. Kim*, "A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%)", Symposium on VLSI Technology and Circuits, 2022/6, Hawai, US

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